Chemical fluid deposition: a hybrid technique for low-temeprature metallization

Chemical fluid deposition: a hybrid technique for low-temeprature metallization

Metal deposition from supercritical CO sub 2 combines the advantages of chemical vapor deposition and aqueous plating without the drawbacks of high temperatures and toxic by-products. This general technique exploits the near- liquid densities and gas-like transport properties of the fluid, and has s...

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Bibliographic Details
Published in:Advanced materials (Weinheim) Vol. 12; no. 12; pp. 913 - 915
Main Authors: Long, D P, Blackburn, J M, Watkins, J J
Format: Journal Article
Language:English
Published: 16-06-2000
Online Access:Get full text
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Summary:Metal deposition from supercritical CO sub 2 combines the advantages of chemical vapor deposition and aqueous plating without the drawbacks of high temperatures and toxic by-products. This general technique exploits the near- liquid densities and gas-like transport properties of the fluid, and has successfully been used to deposit bright, reflective films of Pt, Pd, Au, and Rh. Substrates include polyimide.
Bibliography:ObjectType-Article-2
SourceType-Scholarly Journals-1
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ISSN:0935-9648