Silicon oxide enhanced Schottky gate In sub(0.53)Ga sub(0.47)As FET's with a self-aligned recessed gate structure

The authors present the fabrication and characterization of an In sub(0.53)Ga sub(0.47)As enhanced Schottky gate FET with a self-aligned recessed gate structure. A thin layer of e-beam evaporated silicon oxide was used to reduce the gate leakage current. For a n-channel doping of 8 x 10 super(16) cm...

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Bibliographic Details
Published in:IEEE electron device letters Vol. EDL-5; no. 12; pp. 511 - 514
Main Authors: Cheng, C L, Liao, A S H, Chang, T Y, Caridi, E A, Coldren, L A, Lalevic, B
Format: Journal Article
Language:English
Published: 01-01-1984
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Summary:The authors present the fabrication and characterization of an In sub(0.53)Ga sub(0.47)As enhanced Schottky gate FET with a self-aligned recessed gate structure. A thin layer of e-beam evaporated silicon oxide was used to reduce the gate leakage current. For a n-channel doping of 8 x 10 super(16) cm super(-3) and a gate length of 1.5 mu m, these devices showed good pinchoff characteristics with transconductances of 150 mS/mm. The effective velocity of electrons at current saturation is deduced to be 2.4 x 10 super(7) cm/s at the drain end of the gate. At 3 GHz these devices have a maximum available gain of 10 dB, decreasing to 6 dB at 6 GHz.
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ISSN:0741-3106