Silicon oxide enhanced Schottky gate In(0.53)Ga(0.47)As FET's with a self-aligned recessed gate structure
The fabrication and characterization of an In(0.53)Ga(0.47)As enhanced Schottky gate FET with a self-aligned recessed gate structure are presented. A thin layer of e-beam evaporated silicon oxide was used to reduce the gate leakage current. For a n-channel doping of 8 x 10 to the 16th per cu cm and...
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Published in: | IEEE electron device letters Vol. EDL-5; pp. 511 - 514 |
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Main Authors: | , , , , , |
Format: | Journal Article |
Language: | English |
Published: |
01-12-1984
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Online Access: | Get full text |
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Summary: | The fabrication and characterization of an In(0.53)Ga(0.47)As enhanced Schottky gate FET with a self-aligned recessed gate structure are presented. A thin layer of e-beam evaporated silicon oxide was used to reduce the gate leakage current. For a n-channel doping of 8 x 10 to the 16th per cu cm and a gate length of 1.5 microns, these devices showed good pinchoff characteristics with transconductances of 150 mS/mm. The effective velocity of electrons at current saturation is deduced to be 2.4 x 10 to the 7th cm/s at the drain end of the gate. At 3 GHz these devices have a maximum available gain of 10 dB, decreasing to 6 dB at 6 GHz. |
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Bibliography: | ObjectType-Article-2 SourceType-Scholarly Journals-1 content type line 23 ObjectType-Feature-1 |
ISSN: | 0741-3106 |