Identifying Sources of Decoherence in a dc SQUID Phase Qubit With a Sub-[Formula Omitted] Junction and Interdigitated Capacitor

We fabricated a dc SQUID phase qubit with a sub-[Formula Omitted] [Formula Omitted] qubit junction and an interdigitated shunting capacitor on a sapphire substrate. The qubit junction had a critical current of 135 nA, and the isolation junction had a critical current of 8.3 [Formula Omitted]. The sh...

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Bibliographic Details
Published in:IEEE transactions on applied superconductivity Vol. 21; no. 3; p. 867
Main Authors: Przybysz, Anthony J, Kwon, H, Budoyo, R, Cooper, B. K, Crowe, E, Dragt, A. J, Anderson, J. R, Lobb, C. J, Wellstood, F. C
Format: Journal Article
Language:English
Published: New York The Institute of Electrical and Electronics Engineers, Inc. (IEEE) 01-06-2011
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Summary:We fabricated a dc SQUID phase qubit with a sub-[Formula Omitted] [Formula Omitted] qubit junction and an interdigitated shunting capacitor on a sapphire substrate. The qubit junction had a critical current of 135 nA, and the isolation junction had a critical current of 8.3 [Formula Omitted]. The shunting capacitance was about 1.5 pF. To reduce the unwanted effects of two-level systems and increase the relaxation time [Formula Omitted], we have removed unnecessary dielectrics, used a small qubit junction area (450 nm [Formula Omitted] 500 nm), isolated the qubit from the leads with an on-chip LC filter, and fabricated the device on a bare sapphire substrate. However, at a temperature of 20 mK, we found [Formula Omitted] and the coherence time [Formula Omitted], which was much lower than one would expect from loss attributed to the leads and to dielectrics in the tunnel junction and substrate. Measurements of [Formula Omitted] versus applied flux (which tuned the qubit frequency) revealed a correlation between the strength of the coupling of the microwave excitation line to the qubit and the rate of energy dissipation in the qubit. This result suggests that the relaxation time was being limited by coupling to the microwave line.
ISSN:1051-8223
1558-2515
DOI:10.1109/TASC.2010.2100017