60-GHz Four-Element Phased-Array Transmit/Receive System-in-Package Using Phase Compensation Techniques in 65-nm Flip-Chip CMOS Process Special Issue on Millimeter-Wave Circuits and Systems

• Published in: IEEE transactions on microwave theory and techniques Vol. 60; no. 3; pp. 743 - 756
• Main Authors: KUO, Jing-Lin, LU, Yi-Fong, WANG, James, ALVIN HSU, Yungping, LIN, Kun-You, LU, Hsin-Chia, LIN, Yi-Cheng, LU, Liang-Hung, HUANG, Tian-Wei, WU, Ruey-Beei, HUEI WANG, HUANG, Ting-Yi, CHANG, Yi-Long, HSIEH, Yi-Keng, PENG, Pen-Jui, CHANG, I.-Chih, TSAI, Tzung-Chuen, KAO, Kun-Yao, HSIUNG, Wei-Yuan
• Format: Journal Article
• Language: English
• Published: New York, NY Institute of Electrical and Electronics Engineers 2012
• Subjects: Amplifiers; Antennas; Applied sciences; Circuit properties; Circuits of signal characteristics conditioning (including delay circuits); Design. Technologies. Operation analysis. Testing; Electric, optical and optoelectronic circuits; Electronic circuits; Electronics; Exact sciences and technology; Integrated circuits; Radiocommunications; Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices; Telecommunications; Telecommunications and information theory; Low noise amplifier; Electrostatic discharge; Phased array; 60 GHz; variable gain amplifier (VGA); Phased array antenna; Variable gain amplifier; Phase compensation; wireless communication; Integrated circuit bonding; CMOS; Beam steering; Power combiners; Complementary MOS technology; Ceramic materials; phase-compensated techniques; Bias circuit; Low temperature; Flip chip bonding; Flip-chip; Man machine dialogue; Power electronics; DA converter; Switching; Phase shifter; System in package; Combiner circuit; Digital control; Beamforming; Electrical network; system-in-package (SiP); Power amplifier; Gain
• ISSN: 0018-9480; 1557-9670