Adaptive alignment packaging for 2-D arrays of free-space optical-interconnected optoelectronic systems : Electronic Components and Technology

• Published in: IEEE transactions on advanced packaging Vol. 25; no. 1; pp. 54 - 64
• Main Authors: YANG, Tsung-Yi, GOURLAY, James, WALKER, Andrew C
• Format: Journal Article
• Language: English
• Published: Piscataway, NY Institute of Electrical and Electronics Engineers 2002
• Subjects: Applied sciences; Circuit properties; Electric, optical and optoelectronic circuits; Electronic equipment and fabrication. Passive components, printed wiring boards, connectics; Electronics; Exact sciences and technology; Miscellaneous; Optical and optoelectronic circuits; Optoelectronic devices; Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices; Optical links; Free field; Computer simulation; Feedback system; Adaptive system; Control system; Measurement sensor; Feedback regulation; Two dimensional model; Closed feedback; Optical system; Algorithm performance; Electronic packaging; Optoelectronic device; Error detection; Error correction; Alignment defect; Comparative study; Optical interconnection; Interconnected system
• ISSN: 1521-3323; 1557-9980