YBa sub 2 Cu sub 3 O sub 7 minus x to Si interconnection for hybrid superconductor/ semiconductor integration

We have successfully made low resistance contacts between high-quality films of YBa{sub 2}Cu{sub 3}O{sub 7{minus}{ital x}} (YBCO) and single-crystal Si substrates through Ag-Au interconnections. The YBCO films were deposited by laser ablation on an epitaxial yttria-stabilized zirconia buffer layer o...

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Bibliographic Details
Published in:Applied physics letters Vol. 61:18
Main Authors: Harvey, T.E., Moreland, J., Jeanneret, B., Ono, R.H., Rudman, D.A.
Format: Journal Article
Language:English
Published: United States 02-11-1992
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Summary:We have successfully made low resistance contacts between high-quality films of YBa{sub 2}Cu{sub 3}O{sub 7{minus}{ital x}} (YBCO) and single-crystal Si substrates through Ag-Au interconnections. The YBCO films were deposited by laser ablation on an epitaxial yttria-stabilized zirconia buffer layer on Si and had zero-resistance critical temperatures of 83--85 K after patterning into lines. Specific contact resistivities (resistance-area products) of the YBCO to Si interconnection, limited by the Au to Si interface, of 10{sup {minus}6} {Omega} cm{sup 2} were achieved on heavily doped Si after deposition and patterning of the YBCO film. This demonstrates the use of high-temperature superconductors as a wiring layer compatible with conventional Si metal-oxide-semiconductor processing.
Bibliography:AI05-89ER14044
ISSN:0003-6951
1077-3118
DOI:10.1063/1.108275