X-ray diffraction study of copper-time intermetallic compounds on solder-coated PC boards

X-ray diffraction study of copper-time intermetallic compounds on solder-coated PC boards

X-ray diffraction has been used in conjunction with standard metallography to study the formation and growth of copper-tin intermetallic compounds and their effect on surface morphology on solder-coated printed-circuit boards. The diffraction technique lends itself very well to the detection of thes...

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Bibliographic Details
Published in:Fifth IEEE/CHMT International Electronic Manufacturing Technology Symposium, 1988, 'Design-to-Manufacturing Transfer Cycle pp. 149 - 154
Main Authors: Hong, J., Chason, M.
Format: Conference Proceeding
Language:English
Published: IEEE 1988
Subjects:
Aging
Atmosphere
Coatings
Conducting materials
Copper
Intermetallic
Performance evaluation
Surface morphology
Temperature measurement
X-ray diffraction
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Summary:X-ray diffraction has been used in conjunction with standard metallography to study the formation and growth of copper-tin intermetallic compounds and their effect on surface morphology on solder-coated printed-circuit boards. The diffraction technique lends itself very well to the detection of these compounds and to the monitoring of their evolution during thermal aging, especially in cases where coatings are so thin that various constituent phases cannot otherwise be discussed. Some growth characteristics revealed by this nondestructive method are presented.< >
DOI:10.1109/EMTS.1988.16167