Toxicity Testing Database for Photovoltaic Modules
The purpose of this paper is to present and statistically analyze a TCLP (Toxicity Characteristics Leaching Procedure) database that was created from 94 TCLP test results obtained on 33 crystalline silicon and cadmium telluride modules (1-5 samples and tests per module) from 16 different manufacture...
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Published in: | Conference record of the IEEE Photovoltaic Specialists Conference p. 1026 |
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Main Authors: | , , , , , |
Format: | Conference Proceeding |
Language: | English |
Published: |
IEEE
09-06-2024
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Subjects: | |
Online Access: | Get full text |
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Summary: | The purpose of this paper is to present and statistically analyze a TCLP (Toxicity Characteristics Leaching Procedure) database that was created from 94 TCLP test results obtained on 33 crystalline silicon and cadmium telluride modules (1-5 samples and tests per module) from 16 different manufacturers. The samples (9.5 × 9.5 mm pieces) required for the TCLP testing were cut from each module using a waterjet cutting approach explained in the ASTM E3325:2021 standard. The TCLP results show that there is a 9% failure rate in meeting the TCLP standard, EPA 1311. The database has been statistically analyzed and presented for a correlation between leaching extent of lead (Pb) in the TCLP tests of all the samples and several variables including module age, glass/glass or glass/backsheet construction, cell technology (BSF, PERC, IBC etc.) and interconnection technology (ribbon or wire). A comparative analysis between three pairs of field-aged and fresh modules with identical models and structures revealed that the field-aged modules tend to experience higher layer separation leading to higher leaching potential compared to fresh modules. The statistically predicted Pb leaching extent in: the advanced crystalline silicon cell technologies is lower than the traditional cell technologies; the wire technologies is lower than the ribbon technologies; and, the glass/glass construction is lower than the glass/backsheet construction. |
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ISSN: | 2995-1755 |
DOI: | 10.1109/PVSC57443.2024.10748888 |