Advanced Silicon Technologies: Design Consequences of Scaling Solutions for Devices

Despite multiple roadblocks and 'red-brick" walls identified on its path, the Moore's Law continues towards single Angstrom digits, promising further improvements in device density and energy efficiency. FinFET and Nanosheet technologies bring 3-rd dimension to device design, and new...

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Bibliographic Details
Published in:	2024 31st International Conference on Mixed Design of Integrated Circuits and System (MIXDES) pp. 11 - 14
Main Author:	Brozek, Tomasz
Format:	Conference Proceeding
Language:	English
Published:	Lodz University of Technology 27-06-2024
Subjects:	FinFETs Moore's Law Multichip modules Rails Reviews Scaling Semiconductor device modeling Silicon Silicon Technology SoC Design
Online Access:	Get full text
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Summary:	Despite multiple roadblocks and 'red-brick" walls identified on its path, the Moore's Law continues towards single Angstrom digits, promising further improvements in device density and energy efficiency. FinFET and Nanosheet technologies bring 3-rd dimension to device design, and new back-side power rail schemes decouple power delivery from signal lines. All those new technology solutions change the way the circuits and products are designed, manufactured, packaged, and tested. This paper reviews the impact the technology scaling has on various components of SoC and their designs.
DOI:	10.23919/MIXDES62605.2024.10614020