Design and migration challenges for an alpha microprocessor in a 0.18 mu m copper process

Design and migration challenges for an alpha microprocessor in a 0.18 mu m copper process

The aluminum to copper conversion issues encountered in designing an alpha microprocessor using the multilayered copper interconnects were discussed. An alpha microprocessor design was implemented in a 0.18 mu m CMOS process. The Local Interconnect layer and denser active area design used CMOS trans...

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Bibliographic Details
Published in:Digest of technical papers - IEEE International Solid-State Circuits Conference
Main Authors: Hokinson, R, Benschneider, B, Arneborn, M, Clay, D, Clouser, J, Dumford, S, Kalathur, V, Kalidindi, V, Kovvali, S, Krause, J, Maresh, S, Munger, B, O'Neill, N, Pragaspathy, I, Qin, W
Format: Journal Article
Language:English
Published: 01-01-2001
Online Access:Get full text
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Summary:The aluminum to copper conversion issues encountered in designing an alpha microprocessor using the multilayered copper interconnects were discussed. An alpha microprocessor design was implemented in a 0.18 mu m CMOS process. The Local Interconnect layer and denser active area design used CMOS transmission gates. The copper technology places density restrictions on the interconnect to improve process uniformity. The design satisfies density rules within the physical layout database.
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ISSN:0193-6530