Controlled Distributed Ti3C2Tx Hollow Microspheres on Thermally Conductive Polyimide Composite Films for Excellent Electromagnetic Interference Shielding

• Published in: Advanced materials (Weinheim) Vol. 35; no. 16
• Main Authors: Zhang, Yali, Ruan, Kunpeng, Zhou, Kun, Gu, Junwei
• Format: Journal Article
• Language: English
• Published: Weinheim Wiley Subscription Services, Inc 20-04-2023
• Subjects: Artificial intelligence; Controllability; Electromagnetic interference; electromagnetic interference shielding; Electromagnetic radiation; Electromagnetic shielding; Electronic devices; Finite element method; Heat conductivity; Heat transfer; Iron oxides; Materials science; Mechanical properties; Microspheres; Polyimide resins; Polymethyl methacrylate; polymethyl methacrylate microspheres templates; Pore size distribution; Portable equipment; Tensile strength; Thermal conductivity; Ti 3C 2T x hollow microspheres; Wearable technology
• ISSN: 0935-9648; 1521-4095
• DOI: 10.1002/adma.202211642

Flexible multifunctional polymer‐based electromagnetic interference (EMI) shielding composite films have important applications in the fields of 5G communication technology, wearable electronic devices, and artificial intelligence. Based on the design of a porous/multilayered structure and using polyimide (PI) as the matrix and polymethyl methacrylate (PMMA) microspheres as the template, flexible (Fe3O4/PI)–Ti3C2Tx–(Fe3O4/PI) composite films with controllable pore sizes and distribution of Ti3C2Tx hollow microspheres are successfully prepared by sacrificial template method. Owing to the porous/multilayered structure, when the pore size of the Ti3C2Tx hollow microspheres is 10 µm and the mass ratio of PMMA/Ti3C2Tx is 2:1, the (Fe3O4/PI)–Ti3C2Tx–(Fe3O4/PI) composite film has the most excellent EMI shielding performance, with EMI shielding effectiveness (EMI SE) of 85 dB. It is further verified by finite element simulation that the composite film has an excellent shielding effect on electromagnetic waves. In addition, the composite film has good thermal conductivity (thermal conductivity coefficient of 3.49 W (m·K)−1) and mechanical properties (tensile strength of 65.3 MPa). This flexible (Fe3O4/PI)–Ti3C2Tx–(Fe3O4/PI) composite film with excellent EMI shielding performance, thermal conductivity, and mechanical properties has demonstrated great potential for applications in EMI shielding protection for high‐power, portable, and wearable flexible electronic devices.
Flexible (Fe3O4/polyimide (PI))–Ti3C2Tx–(Fe3O4/PI) composite films with controllable pore sizes and distribution of Ti3C2Tx hollow microspheres show electromagnetic interference shielding effectiveness of 85 dB owing to the magnetic loss in Fe3O4/PI fiber film, multiple reflection, ohmic loss, and polarization loss in Ti3C2Tx hollow microspheres.