Deformation behavior of Nb3Sn type superconductors

The stress levels can be well beyond the yield stress of the materials and therefore plastic flow occurs in selected components, such as Cu stabilizer and Cu-Sn matrix. Because deformation occurs at cryogenic temperatures and limited dynamic recover occurs, a high density of dislocations are accumul...

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Bibliographic Details
Published in:	IEEE transactions on applied superconductivity Vol. 15; no. 2; pp. 3568 - 3571
Main Authors:	CHEN, J, KE HAN, KALU, Peter N, MARKIEWICZ, W. D
Format:	Conference Proceeding Journal Article
Language:	English
Published:	New York, NY Institute of Electrical and Electronics Engineers 01-06-2005 The Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subjects:	Applied sciences Deformation Electrical engineering. Electrical power engineering Electronics Exact sciences and technology Materials Plastic deformation Thermal stress strength High density Nb3 Sn Plastic deformation Dislocation density low temperature superconductor Critical current Plastic material Semiempirical method Composite superconductor Low temperature Strain rate Elastic modulus Shear modulus Thermomechanical properties Empirical model Cryogenic temperature Crystalline material Mechanical stress Shear stress Properties of materials Microstructure Yield stress Strain hardening
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Description
Summary:	The stress levels can be well beyond the yield stress of the materials and therefore plastic flow occurs in selected components, such as Cu stabilizer and Cu-Sn matrix. Because deformation occurs at cryogenic temperatures and limited dynamic recover occurs, a high density of dislocations are accumulated.
ISSN:	1051-8223 1558-2515
DOI:	10.1109/TASC.2005.849362