DEPOSITION OF SILICON OXIDE THIN FILMS IN TEOS WITH ADDITION OF OXYGEN TO THE PLASMA AMBIENT: IR SPECTRA ANALYSIS

Silicon oxide thin films deposited on Si substrates in a RF-plasma CVD reactor, using Si(OC2H5)4 (TEOS) as the precursor and oxygen as the gas ambient, were studied by IR spectrophotometry. All depositions were performed at a substrate temperature of 200 deg C, a plasma power of 20 or 80 W and with...

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Bibliographic Details
Published in:Journal of Optoelectronics and Advanced Materials Vol. 7; no. 1; pp. 389 - 392
Main Authors: Hamelmann, F, Heinzmann, U, Szekeres, A, Kirov, N, Nikolova, T
Format: Journal Article
Language:English
Published: 01-02-2005
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Summary:Silicon oxide thin films deposited on Si substrates in a RF-plasma CVD reactor, using Si(OC2H5)4 (TEOS) as the precursor and oxygen as the gas ambient, were studied by IR spectrophotometry. All depositions were performed at a substrate temperature of 200 deg C, a plasma power of 20 or 80 W and with a DC-bias of -120 V applied to the Si substrate. The observed IR peaks were assigned to corresponding vibrational modes. Peaks related to Si-H, C-H and OH bond vibrations were also detected. Some degree of porosity exists, resulting in a lower refractive index of the films than that typical for SiO2 material.
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ISSN:1454-4164