ATHENIS_3D: Automotive tested high-voltage and embedded non-volatile integrated SoC platform with 3D technology

• Published in: Proceedings - Design, Automation, and Test in Europe Conference and Exhibition pp. 894 - 899
• Main Authors: Wachmann, E, Saponara, S, Zambelli, C, Tisserand, P, Charbonnier, J, Erlbacher, T, Gruenler, S, Hartler, C, Siegert, J, Chassard, P, Ton, D M, Ferrari, L, Fanucci, L
• Format: Journal Article
• Language: English
• Published: 01-03-2016
• Subjects: Automation; Automobiles; Automotive engineering; Avionics; Devices; Electric power generation; Platforms; Three dimensional
• ISSN: 1558-1101

The ATHENIS_3D FP7 EU project aims at providing new enabling technologies (analog, digital and power components) for high-voltage and high-temperature applications, tested for power systems of new hybrid/electrical vehicles. Innovation is exploited at process/device level (3D chip stacking, wafer level packaging, trench capacitors and TSV-inductors integrated in the interposer, high-reliable non-volatile Magnetic RAM), circuit-level (inductorless high-voltage DC-DC converter, high-temperature 28nm System-on-Chip platform) and system-level (compact 3D embedded power mechatronic system). Enabling high integration levels of complex systems, operating in harsh environments, in a single packaged 3D device, ATHENIS_3D allows for one order of magnitude area reduction vs. today PCB-based power and control systems. Integration costs will be consequently reduced in key industrial sectors for Europe where high-voltage/temperature operations are mandatory (vehicles, avionics, space/defense, industrial automation, energy).