Resistance Measurements of BGA Contacts During Reliability Tests

• Published in: 2006 29th International Spring Seminar on Electronics Technology pp. 184 - 187
• Main Authors: Wrona, R., Drozd, Z., Szwech, M.
• Format: Conference Proceeding
• Language: English
• Published: IEEE 01-05-2006
• Subjects: Contact resistance; Electrical resistance measurement; Environmentally friendly manufacturing techniques; Fatigue; Life estimation; Mechanical variables measurement; Packaging; Performance evaluation; Soldering; Testing
• ISBN: 9781424405503; 1424405505
• ISSN: 2161-2528
• DOI: 10.1109/ISSE.2006.365382

For mechanical fatigue tests were designed special test models of BGA package and test board, for measurements of solder joints and ball contact resistance by four-point method, with elimination of paths resistance. This solution allows the early and partial failures detection. The mechanical fatigue test was performed on developed mechanical test stand. The resistance was measured before, during and after reliability test. The preliminary results showed that evaluated test method can be applied for accelerated verification of soldering process especially during implementation of lead-free technology.