Large-scale DWDM photonic integrated circuits: a manufacturable and scalable integration platform

• Published in: 2005 IEEE LEOS Annual Meeting Conference Proceedings pp. 344 - 345
• Main Authors: Joyner, C.H., Pleumeekers, J.L., Mathur, A., Evans, P.W., Lambert, D.J.H., Murthy, S., Mathis, S.K., Peters, F.H., Baeck, J., Missey, M.J., Dentai, A.G., Salvatore, R.A., Schneider, R.P., Ziari, M., Kato, M., Nagarajan, R., Bostak, J.S., Butrie, T., Dominic, V.G., Kauffman, M., Miles, R.H., Mitchell, M.L., Nilsson, A.C., Pennypacker, S.C., Schlenker, R., Taylor, R.B., Huan-Shang Tsai, Van Leeuwen, M.F., Webjorn, J., Perkins, D., Singh, J., Grubb, S.G., Reffle, M., Mehuys, D.G., Kish, F.A., Welch, D.F.
• Format: Conference Proceeding
• Language: English
• Published: IEEE 2005
• Subjects: III-V semiconductor materials; Indium phosphide; Integrated circuit manufacture; Large scale integration; Large-scale systems; Optical devices; Optical transmitters; Photonic integrated circuits; Production; Wavelength division multiplexing
• ISBN: 0780392175; 9780780392175
• ISSN: 1092-8081; 2766-1733
• DOI: 10.1109/LEOS.2005.1548019

Commercial scaling of electronic integrated circuits has proceeded at a fast pace once the initial hurdle to integration was overcome. Recently, it has been shown that record active and passive optical device counts, exceeding 50 discrete components, can be incorporated onto a single monolithic 100 Gbps DWDM transmitter PIC InP chip. We will investigate key production metrics for this large-scale PIC commercial device as well as other analogs to other III-V semiconductor commercial devices. Using the yield management tools pioneered by silicon based electronics, we will present data supporting their scalability and the manufacturability of these large-scale PICs