Characterization and processing of low dielectric constant thick film substrates for electronic packaging applications

• Published in: Proceedings. 4th International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (Cat. No.98EX153) pp. 130 - 133
• Main Authors: Kellerman, D., Retherford, L., Nabatian, D., Bokalo, P., Feng He, Barlow, F., Elshabini, A.
• Format: Conference Proceeding
• Language: English
• Published: IEEE 1998
• Subjects: Ceramics; Dielectric constant; Dielectric materials; Dielectric substrates; Etching; Frequency; Gold; Metallization; Silver; Thick films
• ISBN: 0780347951; 9780780347953
• DOI: 10.1109/ISAPM.1998.664448

The application of the new microsphere Low K thick film material to large MCM-C substrates is discussed in this paper. Processing of large ceramic boards approximately 6.5/spl times/8.5 inches square with 4 metal layers is described. Both screen printed and etched silver and gold metallizations are used for this work. Electrical, physical, and materials characterization of both silver and gold compatible multilayer Low K dielectric material is detailed. High frequency characterization of the material is also discussed, over a wideband frequency bandwidth between 1-12 GHz.