Effect of parasitic inductances on the switching responses of eGaN HEMTs

Compared to Silicon (Si) transistors, Gallium Nitride (GaN) transistors offer superior features and advantages. In fact, GaN transistors have better performances in terms of thermal capacity, switching frequency range, switching losses, power rating, etc. Therefore, they can be considered as an appr...

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Published in:2022 IEEE International Conference on Electrical Sciences and Technologies in Maghreb (CISTEM) Vol. 4; pp. 1 - 6
Main Authors: Wali, Khalil, Ghorbal, Manel Jebali Ben, Naouar, Mohamed Wissem, Ouali, Houssem
Format: Conference Proceeding
Language:English
Published: IEEE 26-10-2022
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Abstract Compared to Silicon (Si) transistors, Gallium Nitride (GaN) transistors offer superior features and advantages. In fact, GaN transistors have better performances in terms of thermal capacity, switching frequency range, switching losses, power rating, etc. Therefore, they can be considered as an appropriate solution for high power density energy conversion systems. In return, they are subjected to several challenges like the necessity to reduce parasitic inductances resulting from the layout of power converters. With the addition of the inherent GaN inductances, a non optimized power converter layout can lead to important voltage ringing and increased power losses. This is mainly due to the high dv/dt across GaN transistors during the switching process. In this context, this paper studies the effect of parasitic inductances on the switching responses of a half bridge converter. The considered converter is built using enhancement mode GaN based High Electron Mobility Transistors (eGaN-HEMTs) and is tested through a Double Pulse Test (DPT) under LTspice software. To show the great effect of parasitic inductances, two model levels were simulated and compared. The first one does not include any parasitic inductances while the second one is a complete model that includes the internal eGaN-HEMTs parasitic inductances in addition to the external ones related to the half bridge converter layout. Simulation tests considering the cases of optimized and non-optimized layouts were analyzed and compared to demonstrate the need for a layout optimization in order to minimize external parasitic inductances.
AbstractList Compared to Silicon (Si) transistors, Gallium Nitride (GaN) transistors offer superior features and advantages. In fact, GaN transistors have better performances in terms of thermal capacity, switching frequency range, switching losses, power rating, etc. Therefore, they can be considered as an appropriate solution for high power density energy conversion systems. In return, they are subjected to several challenges like the necessity to reduce parasitic inductances resulting from the layout of power converters. With the addition of the inherent GaN inductances, a non optimized power converter layout can lead to important voltage ringing and increased power losses. This is mainly due to the high dv/dt across GaN transistors during the switching process. In this context, this paper studies the effect of parasitic inductances on the switching responses of a half bridge converter. The considered converter is built using enhancement mode GaN based High Electron Mobility Transistors (eGaN-HEMTs) and is tested through a Double Pulse Test (DPT) under LTspice software. To show the great effect of parasitic inductances, two model levels were simulated and compared. The first one does not include any parasitic inductances while the second one is a complete model that includes the internal eGaN-HEMTs parasitic inductances in addition to the external ones related to the half bridge converter layout. Simulation tests considering the cases of optimized and non-optimized layouts were analyzed and compared to demonstrate the need for a layout optimization in order to minimize external parasitic inductances.
Author Naouar, Mohamed Wissem
Ghorbal, Manel Jebali Ben
Wali, Khalil
Ouali, Houssem
Author_xml – sequence: 1
  givenname: Khalil
  surname: Wali
  fullname: Wali, Khalil
  email: wali.khalil19@gmail.com
  organization: Université de Tunis El Manar,Ecole Nationale d'Ingénieurs de Tunis LR11ES15, Laboratoire des Systèmes Electriques,Tunis,Tunisie,1002
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  givenname: Manel Jebali Ben
  surname: Ghorbal
  fullname: Ghorbal, Manel Jebali Ben
  email: manel.jebalibenghorbal@enit.utm.tn
  organization: Université de Tunis El Manar,Ecole Nationale d'Ingénieurs de Tunis LR11ES15, Laboratoire des Systèmes Electriques,Tunis,Tunisie,1002
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  givenname: Mohamed Wissem
  surname: Naouar
  fullname: Naouar, Mohamed Wissem
  email: wissem.naouar@enit.utm.tn
  organization: Université de Tunis El Manar,Ecole Nationale d'Ingénieurs de Tunis LR11ES15, Laboratoire des Systèmes Electriques,Tunis,Tunisie,1002
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  givenname: Houssem
  surname: Ouali
  fullname: Ouali, Houssem
  email: Houssem.ouali@alphatechnology.tn
  organization: Société Alpha Technology,Ben Arous,Tunisie,2082
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Snippet Compared to Silicon (Si) transistors, Gallium Nitride (GaN) transistors offer superior features and advantages. In fact, GaN transistors have better...
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SubjectTerms Bridge circuits
GaN based high-electron-mobility transistors (HEMT)
GaN modeling
HEMTs
Inductance
Layout
parasitic inductance
Switches
Transistors
Voltage
Wide Bandgap devices
Title Effect of parasitic inductances on the switching responses of eGaN HEMTs
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