Interface State Density Evaluation of p-Type and n-Type Ge/GeNx Structures by Conductance Technique

SUMMARY Ge‐MIS structures have attracted attention as next‐generation CMOS devices. We have reported that a GeNx/Ge structure with a low interface state density can be made by the electron cyclotron resonance (ECR) plasma technique, and that the interface state density of Ge‐MIS structures can be ev...

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Bibliographic Details
Published in:Electronics and communications in Japan Vol. 98; no. 6; pp. 8 - 15
Main Authors: IWASAKI, TAKURO, ONO, TOSHIRO, OTANI, YOHEI, FUKUDA, YUKIO, OKAMOTO, HIROSHI
Format: Journal Article
Language:English
Published: Blackwell Publishing Ltd 01-06-2015
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Summary:SUMMARY Ge‐MIS structures have attracted attention as next‐generation CMOS devices. We have reported that a GeNx/Ge structure with a low interface state density can be made by the electron cyclotron resonance (ECR) plasma technique, and that the interface state density of Ge‐MIS structures can be evaluated through characteristic analysis in the inversion region even at room temperature. In this report, we evaluate the interface state density of p‐type and n‐type GeNx/Ge structures using the conductance technique at low temperature and characteristic analysis at room temperature, and the related process dependences. We have successfully evaluated the interface characteristics of GeNx/Ge structures. The interface state density was systematically distributed with respect to the midgap, and the density near the midgap was close to that of the GeO2/Ge structure.
Bibliography:istex:295EB4330690EB9AE26D5CE3F71F27EB416540AB
ArticleID:ECJ11655
ark:/67375/WNG-M947QN11-D
ISSN:1942-9533
1942-9541
DOI:10.1002/ecj.11655