Mirror coating and packaging for a horizontal MEMS optical switch array

• Published in: 2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546) Vol. 2; pp. 1400 - 1405 Vol.2
• Main Authors: Li, M., Chung, P.S., Yeung, M.T., Chan, P.S., Liang, T.K., Shu, C., Lai, K.W.C., Li, W.J., Tong, F., Tsang, H.K.
• Format: Conference Proceeding
• Language: English
• Published: Piscataway NJ IEEE 2004
• Subjects: Applied sciences; Circuit properties; Coatings; Design. Technologies. Operation analysis. Testing; Electric, optical and optoelectronic circuits; Electronics; Exact sciences and technology; Integrated circuits; Integrated optics. Optical fibers and wave guides; Micro- and nanoelectromechanical devices (mems/nems); Microelectromechanical systems; Microelectronic fabrication (materials and surfaces technology); Micromechanical devices; Mirrors; Optical and optoelectronic circuits; Optical arrays; Optical design; Optical fibers; Optical switches; Packaging; Prototypes; Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices; Performance evaluation; Integrated optics; Prototype; Dielectric materials; Micromachining; Multiple layer; Dielectric coating; Microelectronic fabrication; Electronic packaging; Optical coating; Optical switch; Microelectromechanical device; Optical fiber
• ISBN: 9780780383654; 0780383656
• ISSN: 0569-5503; 2377-5726
• DOI: 10.1109/ECTC.2004.1320295

A prototype package for a microelectromechanical system (MEMS) optical ON-OFF switch array has been designed, fabricated and assembled. The package consists of a horizontal surface micromachined 3D PolyMUMPs mirror chip, optical fibers and a micro-bench which acts as a carrier for the MEMS chip and optical fiber assemblies. The packaging alignment was achieved using an auto-alignment system. A multi-layer dielectric optical coating has also been designed and applied to enhance the optical performance of the mirrors. The packaged MEMS optical switch has been characterized.