Three-dimensional microscopic analysis of inter-laminar area in cross-ply laminate using a homogenization theory

• Published in: Micro-Nanomechatronics and Human Science, 2004 and The Fourth Symposium Micro-Nanomechatronics for Information-Based Society, 2004 pp. 81 - 86
• Main Authors: Matsuda, T., Okumura, D., Ohno, N., Tokuda, M.
• Format: Conference Proceeding
• Language: English
• Published: Piscataway NJ IEEE 2004
• Subjects: Capacitive sensors; Exact sciences and technology; Instruments, apparatus, components and techniques common to several branches of physics and astronomy; Laminates; Lamination; Manufacturing; Mechanical engineering; Mechanical instruments, equipment and techniques; Micromechanical devices and systems; Microscopy; Microstructure; Optical fiber theory; Performance analysis; Physics; Tensile stress; Carbon fibers; Mechatronics; Laminar flow; Dimensional analysis; Shear stress; Modelling; Microelectromechanical device
• ISBN: 0780386078; 9780780386075
• DOI: 10.1109/MHS.2004.1421281

In this study, the microscopic interaction between 0/spl deg/ and 90/spl deg/-plies at the inter-laminar area of a CFRP cross-ply laminate is investigated by performing the three-dimensional microscopic analysis based on a homogenization theory. To this end, the point-symmetry of internal structure in the laminate is utilized to reduce the domain of analysis by half. Moreover, the substructure method is combined with the homogenization theory in order to decrease computational loads. We then analyze stress distributions at the inter-laminar area of a carbon fiber/epoxy cross-ply laminate subjected to in-plane off-axial tensile load. It is thus shown that inter-laminar shear stress occurs significantly at the interface between 0/spl deg/- and 90/spl deg/-plies. It is also shown that the microscopic interaction between two plies markedly appears only in the vicinity of the interface.