Embedded STT-MRAM for Automotive Applications

Here we summarize the technological requirements and challenges on the road towards an automotive capable embedded 22FDX ® STT-MRAM solution. Especially achieving readability across an extended temperature range and the more stringent chip failure rate criteria require significant advancements from...

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Bibliographic Details
Published in:	2024 8th IEEE Electron Devices Technology & Manufacturing Conference (EDTM) pp. 1 - 3
Main Authors:	Muller, J., Pfefferling, B., Merbeth, T., Otani, Y., Hazen, D. Sanchez, Hula, T., Mansueto, M., Titova, A., Ramasubramanian, L., Grimm, C. V.-B., Weisheit, M., Wolf, G., Kriegerstein, V., Vogel, A., Scharf, P., Wang, Y., Huang, Y., Komma, V. S., Sankar, R. Uma, Yoon, H., Kallensee, O., Naik, V. B., Soss, S.
Format:	Conference Proceeding
Language:	English
Published:	IEEE 03-03-2024
Subjects:	Automotive and eNVM Boron Error correction codes Memory management Resistance Roads STT-MRAM Temperature dependence Temperature distribution
Online Access:	Get full text
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Summary:	Here we summarize the technological requirements and challenges on the road towards an automotive capable embedded 22FDX ® STT-MRAM solution. Especially achieving readability across an extended temperature range and the more stringent chip failure rate criteria require significant advancements from the first generation of consumer/industrial grade eMRAM. The impact of MTJ diameter and simple stack engineering on read margin will be discussed. Furthermore, the automotive readiness of 22FDX ® STT-MRAM will be demonstrated.
DOI:	10.1109/EDTM58488.2024.10511905