Flip-chip mounted, Ku band power amplifier compliant with space applications

Following the trends of today's increased power density into power components arena, latest developments on advanced thermal management at component level are presented. Power flip chip technology was applied to commercial HB20P heterostructure bipolar transistor technology from UMS. Results of...

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Bibliographic Details

Published in:	2002 IEEE MTT-S International Microwave Symposium Digest (Cat. No.02CH37278) Vol. 3; pp. 1389 - 1392 vol.3
Main Authors:	Vendier, O., Fraysse, J.-P., Schaffauser, C., Paillard, M., Drevon, C., Cazaux, J.-L., Floriot, D., Caillas-Devignes, N., Blanck, H., Auxemery, P., de Ceuninck, W., Petersen, R., Haese, N., Rolland, P.-A.
Format:	Conference Proceeding Journal Article
Language:	English
Published:	IEEE 2002
Subjects:	Fingers Gallium arsenide HEMTs Heterojunction bipolar transistors MMICs Packaging Power amplifiers Space technology Temperature Thermal management
Online Access:	Get full text
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