Prediction of Curing Induced Residual Stresses in Polymeric Encapsulation Materials for Microelectronics

• Published in: 2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) pp. 1 - 8
• Main Authors: Schipfer, Christian, Gschwandl, Mario, Fuchs, Peter, Antretter, Thomas, Feuchter, Michael, Morak, Matthias, Tao, Qi, Schingale, Angelika
• Format: Conference Proceeding
• Language: English
• Published: IEEE 19-04-2021
• Subjects: Curing; Encapsulation; Microelectronics; Numerical models; Production; Residual stresses; Vitrification
• DOI: 10.1109/EuroSimE52062.2021.9410855

Surface Mounted Devices (SMDs) are widely spread throughout microelectronics and power electronics. They mostly employ epoxy molding compound (EMC) based encapsulations. Thus, enhanced lifetime assessment methods are necessary. To understand the stress situation in SMDs at the end of the production cycle, an improved model approach for the curing of EMC is implemented within Finite Element Analysis (FEA) simulations. During production in e.g a RTM process, material properties are spatially varying due to different curing degrees. Hence, a mismatch of mechanical properties is present, which in return leads to internal stresses. The introduced model approach is an extension to the work of Gschwandl. et al [1] and includes a stress-free deformation before vitrification, changing material properties during curing as well as plastic deformations and visco-elastic effects. The implementation in numerical FEA simulations allows for a better understanding of arising residual stresses and help optimizing the production cycle of SMDs.