Laser ReSeal - Combination of Accelerometer and Gyroscope Sensors in a Single MEMS Chip Silicon Wafer Processing Technology for Six Degrees of Freedom in Inertial Sensors

• Published in: 2020 IEEE Sensors pp. 1 - 4
• Main Authors: Rumpf, Holger, Frey, Jens, Ritzau, Kurt-Ulrich, Breitling, Achim, Staffeld, Peter, Ametowobla, Mawuli
• Format: Conference Proceeding
• Language: English
• Published: IEEE 25-10-2020
• Subjects: Acceleration; accelerometer; gyroscope; Gyroscopes; inertial sensor; Mechanical sensors; MEMS; Micromechanical devices; Sensors; Silicon; Vents
• ISSN: 2168-9229
• DOI: 10.1109/SENSORS47125.2020.9278830

"Laser ReSeal", a novel innovative combination of laser and semiconductor technology for Micro Electro Mechanical Systems (MEMS) allows the cost efficient fabrication of small, high performance and low power inertial measurement units (combined accelerometers and gyroscopes). The new process solves the intrinsic challenge since these two sensor types require two different operating pressures within one wafer. The laser hermetically seals the sensor cavity of the gyroscope, thus enabling a precise subsequent adjustment of the optimum operating pressure.