An 84.48 Gb/s CMOS D-band Multi-Channel TX System-in-Package

• Published in: 2021 IEEE Radio Frequency Integrated Circuits Symposium (RFIC) pp. 207 - 210
• Main Authors: Hamani, Abdelaziz, Foglia-Manzillo, Francesco, Siligaris, Alexandre, Cassiau, Nicolas, Blampey, Benjamin, Hameau, Frederic, Dehos, Cedric, Clemente, Antonio, Gonzalez-Jimenez, Jose Luis
• Format: Conference Proceeding
• Language: English
• Published: IEEE 07-06-2021
• Subjects: 64-QAM; Arrays; CMOS 45 nm; CMOS technology; D-band; front-end transmitter; high data rate; LO generation; mixer; power amplifiers; Radiofrequency integrated circuits; Silicon-on-insulator; Spectral efficiency; System-on-chip; Wireless communication
• ISSN: 2375-0995
• DOI: 10.1109/RFIC51843.2021.9490422

This paper presents an in-package D-band wireless module co-integrating an innovative channel bonding transmitter IC in 45 nm CMOS PDSOI technology and a patch antenna fabricated using a low-cost printed circuit board process. The transmitter is composed of two up-conversion chains with dedicated millimeter-wave local oscillator generators and operates over contiguous sub-bands around 147.96 GHz. The two sub-band signals are combined off-chip using a substrate integrated waveguide diplexer and radiated by a four-patch antenna array realized on the same laminate substrate. The total output band spans from 139.3 to 156.6 GHz. A data rate of 84.48 Gb/s is demonstrated using 64-QAM. The radiated power is 3.8 dBm at the output 1 dB compression point. The chip consumes 600 mW from a 1-V voltage supply and occupies a compact area of 4.8mm 2 .