A fully modular 1 μm CMOS technology incorporating EEPROM, EPROM and interpoly capacitors

This paper will describe a modular technology which uses a novel integration scheme to include double poly EEPROM, single poly EPROM and an interpoly capacitor. The single poly EPROM [1] has been adopted to simplify the integration issues; the three modules (EEPROM, EPROM and A/D) can be combined in...

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Bibliographic Details
Published in:	ESSDERC '90: 20th European Solid State Device Research Conference pp. 547 - 550
Main Authors:	Cacharelis, Philip J, Hart, Michael J, Wolstenholme, Graham R, Carpenter, Roger D, Johnson, Ian F, Manley, Martin H
Format:	Conference Proceeding
Language:	English
Published:	IEEE 01-09-1990
Subjects:	Capacitors CMOS process CMOS technology EPROM Etching Implants Integrated circuit technology Low voltage Nonvolatile memory Oxidation
Online Access:	Get full text
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Summary:	This paper will describe a modular technology which uses a novel integration scheme to include double poly EEPROM, single poly EPROM and an interpoly capacitor. The single poly EPROM [1] has been adopted to simplify the integration issues; the three modules (EEPROM, EPROM and A/D) can be combined in any combination without affecting their electrical performance.
ISBN:	9780750300650 0750300655