Improved comprehensive thermal model for power electronics building block applications

• Published in: 2011 Twenty-Sixth Annual IEEE Applied Power Electronics Conference and Exposition (APEC) pp. 390 - 395
• Main Authors: Huanhuan Wang, Khambadkone, A M, Erik, B K
• Format: Conference Proceeding
• Language: English
• Published: IEEE 01-03-2011
• Subjects: Finite Element Method (FEM); Heat sinks; Impedance; Insulated gate bipolar transistors; Integrated circuit modeling; Junctions; Mathematical model; short circuit; Thermal model; Transient analysis
• ISBN: 9781424480845; 1424480841
• ISSN: 1048-2334; 2470-6647
• DOI: 10.1109/APEC.2011.5744626

Power electronics devices play a key role in utilizing energy efficiently. When the power demand is highly dynamic and variable, the key requirement is to transfer power to the load with the most appropriate voltage, current, phase and frequency so as to achieve the most efficient conversion of power under all load conditions. IGBT behavior under short circuit and overload turn off condition is thus quite important. In this paper, an improved and comprehensive thermal model for power electronics building block (PEBB) is presented, which provides a higher degree of predictability of temperature, in not only steady state, especially at high current conditions but also under different short circuit failure modes.