Passively Aligned Flip-chip Laser Diodes using Multi-axial Slide-stop Guided Design and Laser Assisted Bonding (LAB) on a CMOS-based Optical Interposer

Passively Aligned Flip-chip Laser Diodes using Multi-axial Slide-stop Guided Design and Laser Assisted Bonding (LAB) on a CMOS-based Optical Interposer

The incorporation of rectangular slide-stop structures improve post-bond accuracy by 1.6X achieving a best-in-class relative axial offset of 0.13μm. High-precision bonder with laser-assisted bonding capability enables heterogeneous integration of optical components with higher packing density due to...

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Bibliographic Details
Published in:2022 European Conference on Optical Communication (ECOC) pp. 1 - 4
Main Authors: Goh, Simon Chun Kiat, Xu, Baochang, Zhang, Yu, Siah, Chun Fei, Zhao, Bo, Sebastian, Rappl, Lee, James Yong Meng, Venkatesan, Suresh, Thean, Aaron Voon Yew, Lim, Yeow Kheng
Format: Conference Proceeding
Language:English
Published: Optica 18-09-2022
Subjects:
Diode lasers
Flip-chip devices
Heating systems
Multichip modules
Optical design
Optical fiber communication
Robustness
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Summary:The incorporation of rectangular slide-stop structures improve post-bond accuracy by 1.6X achieving a best-in-class relative axial offset of 0.13μm. High-precision bonder with laser-assisted bonding capability enables heterogeneous integration of optical components with higher packing density due to a small heat-affected zone radius of 280μm.