Multi resolution TLM methodology

• Published in: Proceedings of the 5th Electronics Packaging Technology Conference (EPTC 2003) pp. 530 - 532
• Main Authors: Oswal, T., Leong Mook Seng, Ooi Ban Leong, Rotaru, M.D., Yeo Mui Seng
• Format: Conference Proceeding
• Language: English
• Published: IEEE 2003
• Subjects: Boundary conditions; Coaxial components; Computational modeling; Electronic mail; Energy conservation; Energy resolution; Joining processes; Microelectronics; Power transmission lines; Testing
• ISBN: 9780780382053; 0780382056
• DOI: 10.1109/EPTC.2003.1271578

Initially modelling using Transmission line modelling method required meshes of equal size to model the power planes. However, to model power planes with small features accurately and efficiently multi-resolution power plane modelling is required. Fine meshes will model area where small features are present and coarse meshes will model area where small features are not present. In this paper, an interfacing model is derived for multi-resolution modelling by interfacing meshes of different resolution. The derived model is verified by modelling a test power plane. Results match closely till 12 GHz and peaks and nulls pattern nicely follow upto 20 GHz when modelled by coarse meshes of dimensions 1 mm by 1 mm and finer meshes.