A 1.5-88 GHz 19.5 dBm output power triple stacked HBT InP distributed amplifier
We demonstrate a wideband and high power distributed amplifier (DA) using an indium phosphide (InP) double heterojunction bipolar transistor (HBT) process. For the first time, a triple stack HBT topology is used in an InP DA to achieve high power and high linearity. The 1.2 mm × 0.7 mm fabricated ch...
Saved in:
Published in: | 2017 IEEE MTT-S International Microwave Symposium (IMS) pp. 20 - 23 |
---|---|
Main Authors: | , , |
Format: | Conference Proceeding |
Language: | English |
Published: |
IEEE
01-06-2017
|
Subjects: | |
Online Access: | Get full text |
Tags: |
Add Tag
No Tags, Be the first to tag this record!
|
Summary: | We demonstrate a wideband and high power distributed amplifier (DA) using an indium phosphide (InP) double heterojunction bipolar transistor (HBT) process. For the first time, a triple stack HBT topology is used in an InP DA to achieve high power and high linearity. The 1.2 mm × 0.7 mm fabricated chip exhibits a measured gain of 16 dB, maximum output power of 19.5 dBm and output third order intercept point (OIP3) of 27.5 dBm. The bandwidth covers 1.5-88 GHz. This makes the gain-bandwidth product (GBP) 546 GHz. To the best of the authors' knowledge, this work reports the highest output power and OIP3 over a wide bandwidth among all published InP distributed amplifiers to date. |
---|---|
DOI: | 10.1109/MWSYM.2017.8059080 |