Fabrication of a parallel inter-board optical interconnection module using transferred multichip bonding

• Published in: 2nd 1998 IEMT/IMC Symposium (IEEE Cat. No.98EX225) pp. 123 - 126
• Main Authors: Ohki, A., Usui, M., Sato, N., Matsuura, N., Katsura, K., Ando, Y.
• Format: Conference Proceeding
• Language: English
• Published: IEEE 1998
• Subjects: Assembly; Optical arrays; Optical device fabrication; Optical devices; Optical films; Optical interconnections; Optical receivers; Optical transmitters; Substrates; Vertical cavity surface emitting lasers
• ISBN: 9780780350908; 0780350901
• DOI: 10.1109/IEMTIM.1998.704537

ParaBIT (parallel inter-board optical interconnection technology) is a promising candidate for large-capacity board-to-board interconnection. In ParaBIT module assembly, a new multichip diebonding technique is needed, because precise optical device chip mounting is required for efficient optical coupling at the E/O (electric/optic conversion) and O/E (optic/electric conversion) interfaces. In this paper, we have proposed a new technique, called TMB (transferred multichip bonding), for the precise mounting of multiple optical device chips. We have also described the detailed procedures of TMB and demonstrated its use in ParaBIT module assembly.