Advanced substrate and packaging technology

• Published in: 2nd 1998 IEMT/IMC Symposium (IEEE Cat. No.98EX225) pp. 18 - 24
• Main Author: Ishida, T.
• Format: Conference Proceeding
• Language: English
• Published: IEEE 1998
• Subjects: Costs; Earth; Electronic equipment; Electronics packaging; Frequency; Mobile handsets; Multimedia systems; Packaging machines; Semiconductor device packaging; Substrates
• ISBN: 9780780350908; 0780350901
• DOI: 10.1109/IEMTIM.1998.704501

Key future semiconductor packaging technology lies in bare-chip packaging technology and high-density circuit board technology. In bare-chip packaging technology, flip-chip packaging has been developed, while in high-density PCB technology, newly-designed substrate structures such as the build-up substrate have been developed. Matsushita have been developing stud-bump bonding (SBB) technology as a bare-chip packaging technology, and the any layer inner via hole (ALIVH) substrate as a high-density PCB. The overall development of packaging technology resulted in the development of the P201KYPER mobile phone with a weight less than 100 g for the first time in 1996 using the ALIVH substrate, and in 1997, we developed the P205HYPER mobile phone with a weight less than 80 g for the first time. The application of SBB and ALIVH technology offered early realization of these products, showing how great a role packaging technology plays in the development of electronic equipment. Considering business objectives to increase the market share by a strong product with higher performance or distinctive characteristics, the importance of semiconductor packaging technology is set to increase dramatically in future. This paper describes the concept, content and roadmap of the technology development, mostly in connection with the packaging technology developed by Matsushita.