Micromachining of Grooves for Cutting Fused Silica Plates with Femtosecond Laser Pulses
Micromachining of grooves and their morphologies for cutting fused silica plates are reported in this paper. A femtosecond laser (pulse width: 172 fs, wavelength: 780 nm, and repetition rate: 1 kHz) is used to machine grooves. Ablations are investigated varying pulse energies, scanning speeds and nu...
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Published in: | 2007 Conference on Lasers and Electro-Optics - Pacific Rim pp. 1 - 2 |
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Main Authors: | , |
Format: | Conference Proceeding |
Language: | English |
Published: |
IEEE
01-08-2007
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Subjects: | |
Online Access: | Get full text |
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