Micromachining of Grooves for Cutting Fused Silica Plates with Femtosecond Laser Pulses

Micromachining of Grooves for Cutting Fused Silica Plates with Femtosecond Laser Pulses

Micromachining of grooves and their morphologies for cutting fused silica plates are reported in this paper. A femtosecond laser (pulse width: 172 fs, wavelength: 780 nm, and repetition rate: 1 kHz) is used to machine grooves. Ablations are investigated varying pulse energies, scanning speeds and nu...

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Bibliographic Details
Published in:2007 Conference on Lasers and Electro-Optics - Pacific Rim pp. 1 - 2
Main Authors: Ahmed, F., Man Seop Lee
Format: Conference Proceeding
Language:English
Published: IEEE 01-08-2007
Subjects:
Laser ablation
Laser beam cutting
Laser beams
Micromachining
Morphology
Optical microscopy
Optical pulses
Silicon compounds
Surface emitting lasers
Ultrafast optics
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Summary:Micromachining of grooves and their morphologies for cutting fused silica plates are reported in this paper. A femtosecond laser (pulse width: 172 fs, wavelength: 780 nm, and repetition rate: 1 kHz) is used to machine grooves. Ablations are investigated varying pulse energies, scanning speeds and number of consecutive passes.
ISBN:1424411734
9781424411733
DOI:10.1109/CLEOPR.2007.4391473