Substrate integrated waveguide with corrugated wall

• Published in: 2008 Asia-Pacific Microwave Conference pp. 1 - 4
• Main Authors: Chen, D.G., Eccleston, K.W.
• Format: Conference Proceeding
• Language: English
• Published: IEEE 01-12-2008
• Subjects: Capacitors; Diodes; Fabrication; Filters; Gunn devices; Insertion loss; Integrated circuit technology; Loss measurement; Microstrip; Waveguide components
• ISBN: 9781424426416; 1424426413
• ISSN: 2165-4727; 2165-4743
• DOI: 10.1109/APMC.2008.4958218

In this work we propose a new SIW structure, called the corrugated SIW (CSIW), which does not require conducting vias to achieve TE 10 type boundary conditions at the side walls. Instead, the vias are replaced by quarter wavelength microstrip stubs arranged in a corrugated pattern on the edges of the waveguide. This, along with series interdigitated capacitors, results in a waveguide section comprising two separate conductors, which facilitates shunt connection of active components such as Gunn diodes.