Finite element analysis of uniaxial bending of ultra-thin silicon dies embedded in flexible foil substrates

We report a Finite Element Model to calculate the bending stress of thin and ultra-thin silicon dies embedded in flexible foil substrates (chip-in-foil package) at lower bending radii. The values of fracture strength computed using Finite Element Analysis showed very good agreement with the experime...

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Bibliographic Details
Published in:	2015 11th Conference on Ph.D. Research in Microelectronics and Electronics (PRIME) pp. 137 - 140
Main Authors:	Palavesam, Nagarajan, Landesberger, Christof, Kutter, Christoph, Bock, Karlheinz
Format:	Conference Proceeding
Language:	English
Published:	IEEE 01-06-2015
Subjects:	bending stress breaking strength chip embedding in foils chip-in-foil critical stress Finite element analysis Flexible electronics Polyimides Silicon Steel steel foil Stress Substrates
Online Access:	Get full text
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Summary:	We report a Finite Element Model to calculate the bending stress of thin and ultra-thin silicon dies embedded in flexible foil substrates (chip-in-foil package) at lower bending radii. The values of fracture strength computed using Finite Element Analysis showed very good agreement with the experimental results. Furthermore, an increase in the fracture or critical stress (bending stress at fracture) of the dies due to embedding in flexible foil substrates was observed. Besides, the impact of foil material and thickness on the bending stress of ultra-thin silicon die is discussed by comparing two foil materials: Stainless Steel and Polyimide.
DOI:	10.1109/PRIME.2015.7251353