Anodic bonding technology of slender glass tube and silicon in pressure sensor packaging

• Published in: 2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013) pp. 813 - 816
• Main Authors: Tao Chen, Lining Sun, Mingqiang Pan, Yangjun Wang, Jizhu Liu, Liguo Chen
• Format: Conference Proceeding
• Language: English
• Published: IEEE 01-12-2013
• Subjects: Bonding; Electron tubes; Glass; Heating; Shape; Silicon; Temperature measurement
• DOI: 10.1109/EPTC.2013.6745834

Anodic bonding technology of semiconductor silicon and glass is a key technology of micro electronic mechanical system (MEMS). Because of large bonding strength and simple process, silicon-glass anodic bonding is popular in piezoresistive pressure sensor. In order to improve sensors performance, the glass tube is designed to be elongated and slender. However, the special design brings difficulty for anodic bonding. The traditional bonding way is unavailable and bonding failure rate increases dramatically. In this paper, the bonding process of slender glass tube and silicon is present, and a novel bonding device is designed based on the silicon-glass bonding process. The results show that the bonding is the best when the cantilever elastic deformation is less than 0.5 mm interface temperature loaded from the silicon is 415°C and the voltage 1200 V is loaded from the position H=2 mm.