Quasi-Optical LO Coupling Validation for a Planarly Integrated 2 × 2 Pixel Heterodyne Array at 1.95 THz

• Published in: 2023 48th International Conference on Infrared, Millimeter, and Terahertz Waves (IRMMW-THz) pp. 1 - 2
• Main Authors: van Berkel, S.L., Maestrini, A., Jung-Kubiak, C., Bosma, Sjoerd, Alonso-delPino, M., Hayton, D., Kooi, Jacob, Siles, J. V., Llombart, Nuria, Mehdi, I., Chattopadhyay, G.
• Format: Conference Proceeding
• Language: English
• Published: IEEE 17-09-2023
• Subjects: Bolometers; Couplings; Instruments; Local oscillators; Packaging; Power measurement; Silicon
• ISSN: 2162-2035
• DOI: 10.1109/IRMMW-THz57677.2023.10299120

Terahertz heterodyne spectrometer instruments have been traditionally limited to a single pixel or a handful of pixels due to integration and assembly constraints and a limited availability of local oscillator (LO) power. As a solution we propose a novel silicon-micromachined planar and modular packaging strategy, that will allow for a dense integration of a large number of pixels. Moreover, the RF- and LO signals will be quasi-optically coupled via two identical but opposite lens arrays, such that a single LO-source can efficiently pump all HEB-mixers of the 2x2 pixel demonstrator array simultaneously. This work reports on an intermediate step, where we validate the lens array performance and LO power coupling efficiency, by slightly modifying the silicon package into a transmit array configuration. In this way, the LO power coupled into the stack is directly reradiated on the other side, which is then measured using a liquid helium cooled bolometer.