Reliability of Silicone and Epoxy Resin Encapsulated Power Modules in HV-H3TRB tests with Thin-Resin coated Dice

Reliability of Silicone and Epoxy Resin Encapsulated Power Modules in HV-H3TRB tests with Thin-Resin coated Dice

Soft silicone gels, as the standard potting materials for power electronic modules, provide little protection against water ingress and thus cannot protect the semiconductors inside the module from corrosion and edge termination breakdown. A novel vacuum assisted potting process employing an epoxy p...

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Bibliographic Details
Published in:2022 International Conference on Electronics Packaging (ICEP) pp. 147 - 148
Main Authors: Steiner, Felix, Wurst, Helge, Leyrer, Benjamin, Ishikawa, Dai, Nakako, Hideo, Blank, Thomas
Format: Conference Proceeding
Language:English
Published: Japan Institute of Electronics Packaging 11-05-2022
Subjects:
Electric breakdown
epoxy
Epoxy resins
HV- H3TRB
insulation breakdown
Materials reliability
Multichip modules
Power electronics
power electronics packaging
Power measurement
Semiconductor device measurement
silicone
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Summary:Soft silicone gels, as the standard potting materials for power electronic modules, provide little protection against water ingress and thus cannot protect the semiconductors inside the module from corrosion and edge termination breakdown. A novel vacuum assisted potting process employing an epoxy potting material and a thin-resin coat on the semiconductor should provide a significantly improved protection against water absorption indicated degradation. For validation, test modules were built up and tested in an HV-H3TRB environment.
DOI:10.23919/ICEP55381.2022.9795398