A new thin film passive integration technology for miniaturisation of mobile phone front end modules: integration of a dual-band power amplifier, switch and diplexer for GSM

• Published in: 2000 IEEE MTT-S International Microwave Symposium Digest (Cat. No.00CH37017) Vol. 3; pp. 1925 - 1928 vol.3
• Main Authors: de Graauw, A., Copetti, C., Weekamp, W.
• Format: Conference Proceeding
• Language: English
• Published: IEEE 2000
• Subjects: Dual band; GSM; Manufacturing; Mobile communication; Mobile handsets; Power generation; Power system harmonics; Substrates; Testing; Transistors
• ISBN: 078035687X; 9780780356870
• ISSN: 0149-645X; 2576-7216
• DOI: 10.1109/MWSYM.2000.862359

The use of a new thin film substrate technology for integrating the critical passive parts of RF-circuits of mobile communication equipment is demonstrated. A very compact module that contains two power-amplifiers, two receive/transmit-switches and a diplex-filter for dual-band GSM mobile phone applications was designed, manufactured and tested in order to demonstrate the miniaturisation possibilities with this technology. With a size of 160 sq. mm, the module meets the GSM output power specifications (2 W at 900 MHz and 1 W at 1800 MHz) and the harmonic attenuation requirements. The realised insertion loss of less then 1.5 dB in the receive- and transmit chain together with a receive-transmit-isolation of over 20 dB is sufficient for most GSM applications.