The effect of bonding sequence on GMR ESD protection

The effect of bonding sequence on GMR ESD protection

One of the key issues for ESD protection in the GMR head gimbal assembly (HGA) and head stack assembly (HSA) processes is how to prevent "metal contact", i.e. the direct contact of the GMR sensor to metal. This paper describes a very effective method for better ESD protection in the HGA an...

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Bibliographic Details
Published in:Electrical Overstress/Electrostatic Discharge Symposium Proceedings 2000 (IEEE Cat. No.00TH8476) pp. 202 - 204
Main Authors: Zhao, F.G., Rock Tao, Hong Tian
Format: Conference Proceeding
Language:English
Published: IEEE 2000
Subjects:
Bonding
CD recording
Electrostatic discharge
Gold
Grounding
Magnetic heads
Magnetic recording
Magnetic sensors
Protection
Wire
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Summary:One of the key issues for ESD protection in the GMR head gimbal assembly (HGA) and head stack assembly (HSA) processes is how to prevent "metal contact", i.e. the direct contact of the GMR sensor to metal. This paper describes a very effective method for better ESD protection in the HGA and HSA processes where the "metal contact" cannot be avoided.
ISBN:9781585370184
1585370185
DOI:10.1109/EOSESD.2000.890046