Kinetics of copper electrodeposition in the presence of triethyl-benzyl ammonium chloride

• Published in: Journal of applied electrochemistry Vol. 33; no. 8; pp. 685 - 692
• Main Authors: VARVARA, S, MURESAN, L, POPESCU, I. C, MAURIN, G
• Format: Journal Article
• Language: English
• Published: Heidelberg Springer 01-08-2003; Springer Verlag
• Subjects: Applied sciences; Chemical Sciences; Chemistry; Electrochemistry; Electrodeposition; Exact sciences and technology; General and physical chemistry; Metallic coatings; Metals. Metallurgy; Production techniques; Study of interfaces; Surface treatment; Scanning electron microscopy; Rotating disk electrode; copper electrodeposition; triethyl-benzyl-ammonium chloride; Transition metal; Experimental study; electrochemical impedance; Surface structure; Copper Sulfates; additives; Medium effect; Morphology; Concentration effect; Electrodeposition; Kinetics; Copper; Electrochemical reaction; Electrical impedance; Additives; copper electrodeposition; electrochemical impedance; triethyl-benzyl-ammonium; chloride
• ISSN: 0021-891X; 1572-8838
• DOI: 10.1023/A:1025069004355

Quasi-steady state hydrodynamic voltammetry at a rotating-disc electrode and electrochemical impedance spectroscopy were used to investigate the influence of triethyl-benzyl-ammonium (TEBA) chloride on the kinetics of copper electrodeposition from sulphate acidic electrolytes. SEM and X-ray diffraction analysis were used to examine the morphology and the structure of copper deposits. The kinetic parameters (i0, *ac, k0), obtained by both Tafel and Koutecky-Levich interpretations lead to the conclusion that TEBA acts as an inhibitor of copper electrodeposition process, as a consequence of its adsorption on the electrode surface. The influence of TEBA on the kinetics of copper electrodeposition was explained in terms of a reaction model confirmed by the simulated impedance spectra. TEBA acts only as a blocking agent competing for adsorption active sites of the cathodic surface with cuprous ions without changing the reaction pathway corresponding to the absence of the additive.