Diamond/ZnO/LiNbO3 structure for packageless acoustic wave sensors

This paper studies the Diamond/ZnO/LiNbO 3 structure, numerically and experimentally, as a candidate for a packageless sensor based on the surface acoustic wave technology. The structure is compared with an AlN/ZnO/LiNbO 3 structure, in order to highlight better performances of diamond with respect...

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Bibliographic Details
Published in:	2017 IEEE SENSORS pp. 1 - 3
Main Authors:	Floer, Cecile, Benedic, Fabien, Zhgoon, Sergei, Talbi, Abdelkrim, Matar, Olivier Bou, Bartoli, Florian, Aubert, Thierry, Moutaouekkil, Mohammed, Mishra, Harshad, McMurtry, Stefan, Hage-Ali, Sami, Elmazria, Omar, Dekkar, Damia, Baudrillart, Benoit
Format:	Conference Proceeding
Language:	English
Published:	IEEE 01-10-2017
Subjects:	Acoustic waves Aluminum nitride Diamond II-VI semiconductor materials III-V semiconductor materials packageless sensor Surface acoustic wave devices waveguiding layer acoustic wave Zinc oxide
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Summary:	This paper studies the Diamond/ZnO/LiNbO 3 structure, numerically and experimentally, as a candidate for a packageless sensor based on the surface acoustic wave technology. The structure is compared with an AlN/ZnO/LiNbO 3 structure, in order to highlight better performances of diamond with respect to AlN. Early experimental results of nanocrystalline diamond growth on ZnO/Si are presented.
DOI:	10.1109/ICSENS.2017.8234393