Experimental analysis and finite element modelling of nano-scratch test applied on 40–120 nm SiCN thin films deposited on Cu/Si substrate

• Published in: Thin solid films Vol. 518; no. 14; pp. 3859 - 3865
• Main Authors: Roy, S., Darque-Ceretti, E., Felder, E., Raynal, F., Bispo, I.
• Format: Journal Article
• Language: English
• Published: Amsterdam Elsevier B.V 03-05-2010; Elsevier
• Subjects: Adhesion; Chemical vapor deposition (including plasma-enhanced cvd, mocvd, etc.); Condensed matter: structure, mechanical and thermal properties; Copper; Cross-disciplinary physics: materials science; rheology; Engineering Sciences; Exact sciences and technology; Finite element modelling; Materials; Materials science; Mechanical and acoustical properties; Methods of deposition of films and coatings; film growth and epitaxy; Nano-scratch; Physical properties of thin films, nonelectronic; Physics; SiCN; Structure and morphology; thickness; Surfaces and interfaces; thin films and whiskers (structure and nonelectronic properties); Thin film structure and morphology; Thin films; Thin films; Nano-scratch; Finite element modelling; Copper; Adhesion; SiCN; Scratching test; Amorphous thin film; Theoretical study; Cracking; Mechanical properties; Coatings; Layer thickness; Interfaces; Finite element method; Tensile stress; Experimental result; Stress effects; PECVD; Tribology
• ISSN: 0040-6090; 1879-2731
• DOI: 10.1016/j.tsf.2010.02.004

In this work, the nano-scratch test is used to characterize the interfacial adhesion of amorphous SiCN thin films deposited by plasma enhanced chemical vapour deposition on Cu/Si substrates. The experimental results show that the critical load
F
c
is directly related to the rupture of the SiCN/Cu interface. A strong linear dependence of
F
c
to the SiCN thickness independently to the adhesion is also put in evidence. A three-dimensional finite element model of the test is then built. The results show a clear relation between the stresses into the coating and the cracking and buckling of the film observed experimentally. We then discuss how the interfacial tensile stresses can explain the increase of
F
c
with the film thickness.