Disturb and its mitigation in Ferroelectric Field-Effect Transistors with Large Memory Window for NAND Flash Applications
We study the disturb characteristics of ferroelectric field-effect transistors (FEFETs) with band-engineered gate stacks. We demonstrate that integrating a dielectric Al 2 O 3 layer within the ferroelectric (FE) Hf 0.5 Zr 0.5 O 2 layer in the gate stack significantly enhances the memory window (MW),...
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Published in: | IEEE electron device letters p. 1 |
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Main Authors: | , , , , , , , , , , , , , , , , , , , |
Format: | Journal Article |
Language: | English |
Published: |
IEEE
24-09-2024
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Subjects: | |
Online Access: | Get full text |
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Summary: | We study the disturb characteristics of ferroelectric field-effect transistors (FEFETs) with band-engineered gate stacks. We demonstrate that integrating a dielectric Al 2 O 3 layer within the ferroelectric (FE) Hf 0.5 Zr 0.5 O 2 layer in the gate stack significantly enhances the memory window (MW), achieving levels suitable for quad-level cell operation (approximately 7.5 V) while operating at a reduced write voltage (below 15 V). Despite these improvements, the band-engineered FEFET exhibits similar pass disturb characteristics in the PGM state as a standard FEFET with an FE-only gate stack. To improve the disturb characteristics, we introduce and validate a periodic refresh-based disturb mitigation scheme, analogous to strategies employed in SSD controllers and flash memory managers for traditional charge trap flash-based NAND chips. This mitigation scheme reduces disturb in the PGM state from ~28% to approximately ~4% in the band-engineered FEFETs, enabling large memory window, lowdisturb operation. |
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ISSN: | 0741-3106 1558-0563 |
DOI: | 10.1109/LED.2024.3467210 |