Co-packaged optics (CPO): status, challenges, and solutions

Due to the rise of 5G, IoT, AI, and high-performance computing applications, datacenter traffic has grown at a compound annual growth rate of nearly 30%. Furthermore, nearly three-fourths of the datacenter traffic resides within datacenters. The conventional pluggable optics increases at a much slow...

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Published in:Frontiers of Optoelectronics (Online) Vol. 16; no. 1; p. 1
Main Authors: Tan, Min, Xu, Jiang, Liu, Siyang, Feng, Junbo, Zhang, Hua, Yao, Chaonan, Chen, Shixi, Guo, Hangyu, Han, Gengshi, Wen, Zhanhao, Chen, Bao, He, Yu, Zheng, Xuqiang, Ming, Da, Tu, Yaowen, Fu, Qiang, Qi, Nan, Li, Dan, Geng, Li, Wen, Song, Yang, Fenghe, He, Huimin, Liu, Fengman, Xue, Haiyun, Wang, Yuhang, Qiu, Ciyuan, Mi, Guangcan, Li, Yanbo, Chang, Tianhai, Lai, Mingche, Zhang, Luo, Hao, Qinfen, Qin, Mengyuan
Format: Journal Article
Language:English
Published: Beijing Higher Education Press 20-03-2023
Springer & Higher Education Press
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Summary:Due to the rise of 5G, IoT, AI, and high-performance computing applications, datacenter traffic has grown at a compound annual growth rate of nearly 30%. Furthermore, nearly three-fourths of the datacenter traffic resides within datacenters. The conventional pluggable optics increases at a much slower rate than that of datacenter traffic. The gap between application requirements and the capability of conventional pluggable optics keeps increasing, a trend that is unsustainable. Copackaged optics (CPO) is a disruptive approach to increasing the interconnecting bandwidth density and energy efficiency by dramatically shortening the electrical link length through advanced packaging and co-optimization of electronics and photonics. CPO is widely regarded as a promising solution for future datacenter interconnections, and silicon platform is the most promising platform for large-scale integration. Leading international companies (e.g., Intel, Broadcom and IBM) have heavily investigated in CPO technology, an inter-disciplinary research field that involves photonic devices, integrated circuits design, packaging, photonic device modeling, electronic-photonic co-simulation, applications, and standardization. This review aims to provide the readers a comprehensive overview of the state-of-the-art progress of CPO in silicon platform, identify the key challenges, and point out the potential solutions, hoping to encourage collaboration between different research fields to accelerate the development of CPO technology.
Bibliography:Document received on :2022-06-09
External laser
Optical power delivery
High-performance computing
Advanced packaging
Document accepted on :2022-08-22
Standardization
Transmitter
Silicon photonics
Receiver
Co-simulation
Co-packaged optics
ObjectType-Article-1
SourceType-Scholarly Journals-1
ObjectType-Feature-2
content type line 23
ISSN:2095-2759
2095-2767
2095-2767
DOI:10.1007/s12200-022-00055-y