Half-Heusler phase TmNiSb under pressure: intrinsic phase separation, thermoelectric performance and structural transition
Half-Heusler (HH) phase TmNiSb was obtained by arc-melting combined with high-pressure high-temperature sintering in conditions: p = 5.5 GPa, T HPHT = 20, 250, 500, 750, and 1000 ∘ C. Within pressing temperatures 20–750 ∘ C the samples maintained HH structure, however, we observed intrinsic phase...
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Published in: | Scientific reports Vol. 13; no. 1; p. 1592 |
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Main Authors: | , , , , , , , |
Format: | Journal Article |
Language: | English |
Published: |
London
Nature Publishing Group UK
28-01-2023
Nature Publishing Group Nature Portfolio |
Subjects: | |
Online Access: | Get full text |
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Summary: | Half-Heusler (HH) phase TmNiSb was obtained by arc-melting combined with high-pressure high-temperature sintering in conditions:
p
= 5.5 GPa,
T
HPHT
= 20, 250, 500, 750, and 1000
∘
C. Within pressing temperatures 20–750
∘
C the samples maintained HH structure, however, we observed intrinsic phase separation. The material divided into three phases: stoichiometric TmNiSb, nickel-deficient phase TmNi
1
-
x
Sb, and thulium-rich phase Tm(NiSb)
1
-
y
. For TmNiSb sample sintered at 1000
∘
C, we report structural transition to LiGaGe-type structure (
P
6
3
mc
,
a
= 4.367(3) Å,
c
= 7.138(7) Å). Interpretation of the transition is supported by X-ray powder diffraction, electron back-scattered diffraction, ab-initio calculations of Gibbs energy and phonon dispersion relations. Electrical resistivity measured for HH samples with phase separation shown non-degenerate behavior. Obtained energy gaps for HH samples were narrow (
≤
260 meV), while the average hole effective masses in range 0.8–2.5
m
e
. TmNiSb sample pressed at 750
∘
C achieved the biggest power factor among the series, 13
μ
WK
-
2
cm
-
1
, which proves that the intrinsic phase separation is not detrimental for the electronic transport. |
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Bibliography: | ObjectType-Article-1 SourceType-Scholarly Journals-1 ObjectType-Feature-2 content type line 23 |
ISSN: | 2045-2322 2045-2322 |
DOI: | 10.1038/s41598-023-28110-4 |