Phase-field model for solidification of Fe–C alloys
The phase-field model for binary alloys by Kim et al. is briefly introduced and the main difference in the definition of free energy density in interface region between the models by Kim et al. and by Wheeler et al. is discussed. The governing equations for a dilute binary alloy are derived and the...
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Published in: | Science and technology of advanced materials Vol. 1; no. 1; pp. 43 - 49 |
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Main Authors: | , , , |
Format: | Journal Article |
Language: | English |
Published: |
Elsevier Ltd
01-01-2000
Taylor & Francis IOP Publishing |
Subjects: | |
Online Access: | Get full text |
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Summary: | The phase-field model for binary alloys by Kim et al. is briefly introduced and the main difference in the definition of free energy density in interface region between the models by Kim et al. and by Wheeler et al. is discussed. The governing equations for a dilute binary alloy are derived and the phase-field parameters are obtained at a thin interface limit. The examples of the phase-field simulation on Ostwald ripening, isothermal dendrite growth and particle/interface interaction for Fe–C alloys are demonstrated. In Ostwald ripening, it is shown that small solid particles preferably melt out and then large particles agglomerate. In isothermal dendrite growth, the kinetic coefficient dependence on growth rate is examined for both the phase-field model and the dendrite growth model by Lipton et al. The growth rate by the dendrite model shows strong kinetic coefficient dependence, though that by the phase-field model is not sensitive to it. The particle pushing and engulfment by interface are successfully reproduced and the critical velocity for the pushing/engulfment transition is estimated. Through the simulation, it is shown that the phase-field model correctly reproduces the local equilibrium condition and has the wide potentiality to the applications on solidification. |
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Bibliography: | ObjectType-Article-2 SourceType-Scholarly Journals-1 ObjectType-Feature-1 content type line 23 |
ISSN: | 1468-6996 1878-5514 |
DOI: | 10.1016/S1468-6996(99)00004-2 |